V510i DST

Overview Award-winning V510i 3D AOI Solution is designed specifically for dual-sided assembly inspection, particularly post-THT wave-soldering and selective soldering processes. Equipped with high-resolution technology and AI-powered capabilities, the V510i 3D AOI Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.
Key Features
  1. 1. High speed and accurate inspection with Real 3D Measurement
  2. 2. AI-Powered technology for Automated, Smart, Easy and Quality programming and after-inspection judgement
  3. 3. Dual-sided vision system for simultaneous Top and bottom inspection
  4. 4. Support very tall component inspection coverage for top side (up to 100mm tall component)
  5. 5. Unique and universal detection coverage for unconventional application
  6. 6. AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning
  7. 7. Preferred choice of Top EMS Companies
  8. 8. Smart manufacturing ready
 

Specification

System Performances
Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement
Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
System Hardware  
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size * TOP: Default : 60mm x 45mm @ 15µm telecentric lens
Option:
52mm x 39mm @ 13µm telecentric lens
40mm x 30mm @ 10µm telecentric lens

BOTTOM:
Default: 52mm x 39mm @ 13µm telecentric lens
Option:40mm x 30mm @ 10µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15μm resolution : up to 64cm²/sec
3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors
Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Top Clamping; In-line SMEMA
Board Dimension
Maximum Board Size (L x W) 700mm x 510mm (27.5" x 20")
Minimum Board Size (L x W) 50mm x 50mm (2" x 2")
Maximum PCB Inspectable Area (L x W) 700mm x 503mm (27.5" x 19.8")
Maximum PCB Thickness 10mm (0.39")
Minimum PCB Thickness 0.5mm (0.02")
Maximum PCB Weight 10kg
Option: 20kg
Top Clearance of PCB 100mm
Bottom Clearance of PCB 50mm
PCB Edge Clearance 3mm
PCB Transport Height 890mm - 965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification  
System Footprint (Width X Depth X Height) 1290mm x 2028mm x 1860mm
Total System Weight ~1610kgs
Power Supplies 100-120V, 16A/200-240V, 8A Single Phase
Air Requirement 0.6 Mpa/85 psi
Remark * Based on system configuration.

Note:
1. 12MP Angle Camera option is available for top side vision
Specifications are subject to change.

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