“Side-view Optical BGA Inspection Systems”
Premium BGA Solder Joints Inspection

New generation side-view optical system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components.

• Inspectis Digital Microscope, 5MP, USB3.0 interface
• Interchangeable 90° side-view BGA inspection lens
• Interchangeable 8-80x top-view varifocal lens
• INSPECTIS© ProX BGA Inspection software
• Calibration Micrometre Scale for BGA
• Microprism Background Illumination Unit with LED light source
• Fibre Optics Background Illumination Unit with High-power LED light source
• Stand with Rack&Pinion, soft-touch and pivoting bracket, standard size
• Precision XY-stage with antistatic mat and magnetic pegs
• Aluminium Carrying Case for Microscope, BGA Lens and Illumination