vity, Wire bond analysis, Micro BGA / chip on chop analysis ฯลฯ| Max kv | 160 kV |
|---|---|
| Power rating | 20 W (radiography), 10 W (CT)1 |
| X-ray source | Open tube transmission target |
| Focal spot size | 1 µm1 (below 2 W) |
| Defect recognition capability | 500 nm |
| Geometric magnification | 2,046x |
| System magnification | Up to 36,000x |
| Imaging system (Option) | Varex 1515DX (1.3 Mpixel, 16-bit) Flatpanel Varex 2520DX (2.85 Mpixel, 16-bit) Flatpanel Varex 1512 (2.85 Mpixel, 14-bit) Flatpanel |
| Manipulator | 5-axis (X, Y, Z, T, R) |
| Rotate axis | Included |
| Tilt | 0 - 72 degrees |
| Measuring volume | Largest square in single map 406x406 mm (16x16") Maximum physical sample size 711x762 mm (28x30") |
| Max. sample weight | 5 kg (11 lbs) |
| Monitor | Single 4k IPS (3840x2160 pixels) |
| Cabinet dimensions (WxDxH ) |
1200 x 1786 x 1916 mm (48.0x71.3x75.4") |
| Weight | 2.100 kg (4,692 lbs) |
| Radiation safety | <1μSv/hr at the cabinet surface |
| Control | Inspect-X control and analysis software |
| Automated inspection | Included |
| Computed Tomography | Optional CT and/or X.Tract |
| Primary applications | Real-time and automated electronics and semiconductor inspection, failure analysis (BGA, μBGA, flip-chip and loaded PCB boards) |