The TH3000i Max is designed to support the industry trend toward larger package sizes driven by Artificial Intelligence (A.I), High-Performance Computing (HPC), and 5G Technology. Built on the proven platform, it is engineered to handle the latest extra-thick JEDEC Tray standards for bigger devices.
 
Key Highlights:
• Supports package sizes above 130mm and extra-thick JEDEC trays
• Same trusted TH3000i architecture with expanded tray handling width
• Upgraded pick-and-place system for precise large-area image stitching
• Advanced vision options: 4-Side Direct View, SWIR imaging, die warpage inspection
• Smart automation: Auto Nozzle Changer, Foreign Material Cleaner, AUX Tray
• AMR-ready for fully automated production lines
 
Contact for more information at
Industrial Instruments Division
Hollywood International Ltd.
Tel : 02-653-8555, 02-653-8255, 02-251-6032 (30 lines) ต่อ 700, 701, 720, 726
E-mail :  inds@hollywood.co.th
http://www.hollywood.co.th