CyberOptics WX3000™

WX3000™ Metrology and Inspection Systems for Wafer-Level and Advanced Packaging
The WX3000 3D and 2D metrology and inspection system provides ultimate combinations of high speed, high resolution, and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression™ (MRS) Sensor Technology.
Powered by Multi-Reflection Suppression (MRS) Sensor Technology
The 3-micron NanoResolution (X/Y resolution of 3 microns, Z resolution of 50 nanometers) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.
Increases the throughput of 100% for 3D and 2D metrology and inspections can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D and only sampling of a few dies. Delivering a greater than 25 wafers (300mm) per hour for 12″ and 8″ wafer sizes and 55 wafers per hour (200mm) for 6″ and 8″ wafer sizes.

For further information, please contact as below;
Industrial Instruments Division
Hollywood International Ltd.
Tel : 02-653-8555, 02-653-8255, 02-251-6032 (30 lines) ต่อ 710, 712, 715, 720, 727, 728, 729
E-mail : inds@hollywood.co.th
http://www.hollywood.co.th